Junction formation in thick-oxide and thin-oxide vertical fets on the same chip

ABSTRACT

A method for manufacturing a semiconductor device includes forming a first plurality of fins in a first device region on a substrate, forming a second plurality of fins in a second device region on the substrate, forming bottom source/drain regions on the substrate and around lower portions of each of the first and second plurality of fins in the first and second device regions, forming a dummy spacer layer on the bottom source/drain region in the first device region, wherein the dummy spacer layer includes one or more dopants, and forming a plurality of doped regions in the first and second plurality of fins in the first and second device regions, wherein the plurality of doped regions in the first device region extend to a greater height on the first plurality of fins than the plurality of doped regions in the second device region on the second plurality of fins.

TECHNICAL FIELD

The field generally relates to semiconductor devices and methods ofmanufacturing same and, in particular, to forming different bottomsource-drain junction profiles for thick-oxide and thin-oxide devices ona same substrate.

BACKGROUND

Fin field-effect transistor (FinFET) devices include a transistorarchitecture that uses raised source-to-drain channel regions, referredto as fins. A FinFET device can be built on a semiconductor substrate,where a semiconductor material, such as silicon, is patterned intofin-like shapes and functions as the channels of the transistors. KnownFinFET devices include fins with source/drain regions on lateral sidesof the fins, so that current flows in a horizontal direction (e.g.,parallel to a substrate) between source/drain regions at opposite endsof the fins in the horizontal direction. As horizontal devices arescaled down, there is reduced space for metal gate and source/draincontacts, which leads to degraded short-channel control and increasedmiddle of the line (MOL) resistance.

Vertical field effect transistors (VFETs) are becoming viable deviceoptions for semiconductor devices, for example, complementary metaloxide semiconductor (CMOS) devices, beyond 5 nanometer (nm) node. VFETdevices include fin channels with source/drain regions at ends of thefin channels on top and bottom sides of the fins. Current runs throughthe fin channels in a vertical direction (e.g., perpendicular to asubstrate), for example, from a bottom source/drain region to a topsource/drain region. Vertical transport architecture devices aredesigned to extend the product value proposition beyond conventionalplateaus and address the limitations of horizontal device architecturesby, for example, decoupling of gate length from the contact gate pitch,providing a FinFET-equivalent density at a larger contacted poly pitch(CPP), and providing lower MOL resistance.

Due to a variety of applications, devices having both relatively thinand thick gate oxides are needed. For example, relatively thicker gateoxide devices are needed for technologies (e.g., input/output (I/O),analog, etc.) requiring higher drain supply voltage (V_(dd)). Due to thedifferent gate oxide thicknesses, in order to avoid degradedperformance, thick and thin gate oxide devices require different bottomsource-drain junction profiles from each other.

SUMMARY

According to an exemplary embodiment of the present invention, a methodfor manufacturing a semiconductor device includes forming a firstplurality of fins in a first device region on a substrate, forming asecond plurality of fins in a second device region on the substrate,forming bottom source/drain regions on the substrate and around lowerportions of each of the first and second plurality of fins in the firstand second device regions, forming a dummy spacer layer on the bottomsource/drain region in the first device region, wherein the dummy spacerlayer includes one or more dopants, and forming a plurality of dopedregions in the first and second plurality of fins in the first andsecond device regions, wherein the plurality of doped regions in thefirst device region extend to a greater height on the first plurality offins than the plurality of doped regions in the second device region onthe second plurality of fins.

According to an exemplary embodiment of the present invention, asemiconductor device includes a plurality of vertical transistors on asubstrate, wherein each of the plurality of vertical transistorsincludes a channel region extending vertically from the substrate,wherein the channel region includes a junction portion extendingvertically from a bottom of the channel region, a bottom source/drainregion on the substrate and around a lower portion of the channelregion, a gate structure on the bottom source/drain region, wherein thegate structure comprises a gate oxide layer, and a top source/drainregion on the gate structure and extending from the channel region,wherein a junction portion corresponding to a first vertical transistorof the plurality of vertical transistors extends to a greater heightabove a corresponding bottom source/drain region of the first verticaltransistor than a junction portion corresponding to a second verticaltransistor of the plurality of vertical transistors.

According to an exemplary embodiment of the present invention, a methodfor manufacturing a semiconductor device includes forming a firstplurality of channel regions in a first device region on a substrate,forming a second plurality of channel regions in a second device regionon the substrate, forming bottom source/drain regions on the substrateand around lower portions of each of the first and second plurality ofchannel regions in the first and second device regions, forming a dummyspacer layer on the bottom source/drain region in the first deviceregion, wherein the dummy spacer layer includes one or more dopants, andforming a plurality of junction portions in the first and secondplurality of channel regions in the first and second device regions,wherein the plurality of junction portions in the first device regionextend to a greater height above the bottom source/drain regions thanthe plurality of junction portions in the second device region.

These and other exemplary embodiments of the invention will be describedin or become apparent from the following detailed description ofexemplary embodiments, which is to be read in connection with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the present invention will be described belowin more detail, with reference to the accompanying drawings, of which:

FIG. 1 is a cross-sectional view of fin formation in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating dielectric layerdeposition and formation of isolation regions in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

FIG. 3 is a cross-sectional view of patterning the dielectric layer intogate and isolation regions in a method of manufacturing a semiconductordevice, according to an exemplary embodiment of the present invention.

FIG. 4 is a cross-sectional view of bottom source/drain formation in amethod of manufacturing a semiconductor device, according to anexemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view of dummy spacer formation in a methodof manufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

FIG. 6 is a cross-sectional view of dummy spacer removal from a thinoxide device region in a method of manufacturing a semiconductor device,according to an exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view of removal of an organic planarizationlayer (OPL) and bottom junction drive-in annealing in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

FIG. 8 is a cross-sectional view of dummy spacer removal from a thickoxide device region and bottom spacer formation in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

FIG. 9 is a cross-sectional view of gate structure formation in a methodof manufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

FIG. 10 is a cross-sectional view of recessing of gate structures in amethod of manufacturing a semiconductor device, according to anexemplary embodiment of the present invention.

FIG. 11 is a cross-sectional view of formation of top spacers, topsource/drain regions and top source-drain junctions in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention.

DETAILED DESCRIPTION

Exemplary embodiments of the invention will now be discussed in furtherdetail with regard to semiconductor devices and methods of manufacturingsame and, in particular, to different bottom source-drain junctionprofiles depending on a thickness of a gate oxide in verticaltransistors on the same substrate.

It is to be understood that the various layers and/or regions shown inthe accompanying drawings are not drawn to scale, and that one or morelayers and/or regions of a type commonly used in, for example, acomplementary metal-oxide semiconductor (CMOS), nanowire field-effecttransistor (FET), fin field-effect transistor (FinFET),metal-oxide-semiconductor field-effect transistor (MOSFET), VFET, singleelectron transistor (SET) and/or other semiconductor devices may not beexplicitly shown in a given drawing. This does not imply that the layersand/or regions not explicitly shown are omitted from the actual devices.In addition, certain elements may be left out of particular views forthe sake of clarity and/or simplicity when explanations are notnecessarily focused on the omitted elements. Moreover, the same orsimilar reference numbers used throughout the drawings are used todenote the same or similar features, elements, or structures, and thus,a detailed explanation of the same or similar features, elements, orstructures will not be repeated for each of the drawings.

The semiconductor devices and methods for forming same in accordancewith embodiments of the present invention can be employed inapplications, hardware, and/or electronic systems. Suitable hardware andsystems for implementing embodiments of the invention may include, butare not limited to, personal computers, communication networks,electronic commerce systems, portable communications devices (e.g., celland smart phones), solid-state media storage devices, functionalcircuitry, etc. Systems and hardware incorporating the semiconductordevices are contemplated embodiments of the invention. Given theteachings of embodiments of the invention provided herein, one ofordinary skill in the art will be able to contemplate otherimplementations and applications of embodiments of the invention.

The embodiments of the present invention can be used in connection withsemiconductor devices that may require, for example, VFETs, nanowireFETs, nanosheet FETs, SETs, CMOSs, MOSFETs and/or FinFETs. By way ofnon-limiting example, the semiconductor devices can include, but are notlimited to VFET, nanowire FET, nanosheet FET, SET, CMOS, MOSFET andFinFET devices, and/or semiconductor devices that use CMOS, MOSFET,VFET, nanowire FET, nanosheet FET, SET and/or FinFET technology.

As used herein, “height” refers to a vertical size of an element (e.g.,a layer, trench, hole, opening, etc.) in the cross-sectional viewsmeasured from a bottom surface to a top surface of the element, and/ormeasured with respect to a surface on which the element is located.Conversely, a “depth” refers to a vertical size of an element (e.g., alayer, trench, hole, opening, etc.) in the cross-sectional viewsmeasured from a top surface to a bottom surface of the element. Termssuch as “thick”, “thickness”, “thin” or derivatives thereof may be usedin place of “height” where indicated.

As used herein, “lateral,” “lateral side,” “lateral surface” refers to aside surface of an element (e.g., a layer, opening, etc.), such as aleft or right side surface in the drawings.

As used herein, “width” or “length” refers to a size of an element(e.g., a layer, trench, hole, opening, etc.) in the cross-sectionalviews measured from a side surface to an opposite surface of theelement. Terms such as “thick”, “thickness”, “thin” or derivativesthereof may be used in place of “width” or “length” where indicated.

As used herein, terms such as “upper”, “lower”, “right”, “left”,“vertical”, “horizontal”, “top”, “bottom”, and derivatives thereof shallrelate to the disclosed structures and methods, as oriented in thedrawing figures. For example, as used herein, “vertical” refers to adirection perpendicular to the top surface of the substrate in thecross-sectional views, and “horizontal” refers to a direction parallelto the top surface of the substrate in the three-dimensional and/orcross-sectional views.

As used herein, unless otherwise specified, terms such as “on”,“overlying”, “atop”, “on top”, “positioned on” or “positioned atop” meanthat a first element is present on a second element, wherein interveningelements may be present between the first element and the secondelement. As used herein, unless otherwise specified, the term “directly”used in connection with the terms on”, “overlying”, “atop”, “on top”,“positioned on” or “positioned atop” or the term “direct contact” meanthat a first element and a second element are connected without anyintervening elements, such as, for example, intermediary conducting,insulating or semiconductor layers, present between the first elementand the second element.

As used herein, “source-drain junctions” refer to the doped portions(doped with the same type of dopants as the source and drain regions)next to or into channel regions (e.g., fins, nanowires, etc.) of avertical transistor device, such as, but not necessarily limited to, aVFET.

Embodiments of the present invention provide methods and structures forforming different bottom source-drain junction profiles for thick-oxideand thin-oxide devices. In a non-limiting illustrative example, thickgate oxide VFET devices may have about 2 nm to 10 nm thicker gate oxidelayers than thin gate oxide VFET devices, which may have, for examplegate oxides that are about 2 nm thick. Due to the different gate oxidethicknesses between thin and thick gate oxide devices, if the samejunction formation process to form a junction in a thin-oxide device isused for a thicker oxide device, a bottom source-drain junction of thethick-oxide device would not penetrate high enough into a fin relativeto a position of the bottom of a gate structure. In other words, dopantdiffusion from a bottom side of a fin via diffusion from a heavily dopedbottom source/drain region is not sufficient to create a source-drainjunction profile in the fin which penetrates high enough into the fin tocompensate for the thicker gate oxide on the bottom spacer. According toan exemplary embodiment of the present invention, a dummy spacer layerincluding, for example, PSG (phospho-silicate glass), BSG (boro-silicateglass) or BPSG (boro-phospho-silicate glass) is formed on the bottomsource/drain region in a thick oxide device portion. The dummy spacerlayer, since it is positioned on top of the bottom source drain region,provides dopants (e.g., phosphorous or boron) to be diffused intoadjacent fins at a greater vertical height along the fins than thebottom source/region. As a result, in accordance with embodiments of thepresent invention, source-drain junction profiles in fins for thickergate oxide devices penetrate higher in the fin to correspond to bottomsurfaces of gate structures at greater vertical heights due to thickerunderlying gate oxides. The embodiments of the present invention providefor structures and process flows to address the foregoing issues andensure optimized junction profiles of both thick-oxide and thin-oxidedevices.

FIG. 1 is a cross-sectional view of fin formation in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 1, asemiconductor substrate 101 includes semiconductor material including,but not limited to, silicon (Si), silicon germanium (SiGe), siliconcarbide (SiC), Si:C (carbon doped silicon), silicon germanium carbide(SiGeC), carbon doped silicon germanium (SiGe:C), III-V, II-V compoundsemiconductor or other like semiconductor. In addition, multiple layersof the semiconductor materials can be used as the semiconductor materialof the substrate. The semiconductor substrate 101 can be a bulksubstrate or a semiconductor-on-insulator substrate such as, but notlimited to, a silicon-on-insulator (SOI), silicon-germanium-on-insulator(SGOI) or III-V-on-insulator substrate including a buried insulatinglayer, such as, for example, a buried oxide, nitride layer or aluminumoxide.

Fins, such as fins 105, can be formed by patterning a semiconductorlayer into the fins 105. The semiconductor layer can include, but is notnecessarily limited to, Si, SiGe or III-V materials, and may beepitaxially grown. According to an embodiment, a hardmask 110 including,for example, a dielectric material, such as silicon nitride (SiN) isformed on portions of the semiconductor layer that are to be formed intothe fins 105. The fin patterning can be done by various patterningtechniques, including, but not necessarily limited to, directionaletching and/or a sidewall image transfer (SIT) process, for example. TheSIT process includes using lithography to form a pattern referred to asa mandrel. The mandrel material can include, but is not limited to,amorphous silicon or amorphous carbon. After the mandrel formation, aconformal film can be deposited and then followed by an etchback. Theconformal film will form spacers at both sides of the mandrel. Thespacer material can include, but is not limited, oxide or SiN. Afterthat, the mandrel can be removed by reactive ion etching (ME) processes.As a result, the spacers will have half the pitch of the mandrel. Inother words, the pattern is transferred from a lithography-definedmandrel to spacers, where the pattern density is doubled. The spacerpattern can be used as the hard mask to form the fins by RIE processes.While embodiments of the present invention describe channel regions asfins, the embodiments are not necessarily limited to fin channelregions, and may include nanowire channel regions. In addition, althoughfour fins 105 are shown in the figures for ease of explanation, more orless than four fins can be formed.

FIG. 2 is a cross-sectional view illustrating dielectric layerdeposition and formation of isolation regions in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 2, trenches 115are formed in the substrate 101, by for example, a wet or dry etchprocess. A dielectric material layer 120, including, but not necessarilylimited to silicon dioxide (SiO₂), low-temperature oxide (LTO),high-temperature oxide (HTO), flowable oxide (FOX), silicon oxycarbide(SiOC), silicon oxycarbonitride (SiOCN) or some other dielectric, isformed on the substrate 101 and in the trenches 115, and around the fins105. The dielectric material can be deposited using depositiontechniques including, but not limited to, chemical vapor deposition(CVD), plasma enhanced CVD (PECVD), radio-frequency CVD (RFCVD),physical vapor deposition (PVD), atomic layer deposition (ALD),molecular layer deposition (MLD), molecular beam deposition (MBD),pulsed laser deposition (PLD), liquid source misted chemical deposition(LSMCD), and/or sputtering, followed by a planarization process down tothe hardmasks 110, such as, chemical mechanical planarization (CMP) toremove excess dielectric material.

FIG. 3 is a cross-sectional view of patterning the dielectric layer intogate and isolation regions in a method of manufacturing a semiconductordevice, according to an exemplary embodiment of the present invention.Referring to FIG. 3, portions of the dielectric layer 120 are removedfrom around the fins 110 in what are the gate regions G1 and G2. Theremoval of the portions of the dielectric layer 120 from the gateregions G1 and G2 defines isolation regions 121, such as, for example,shallow trench isolation (STI) regions. The patterning of the dielectriclayer 120 can be performed using appropriate masking and removaltechniques, including, but not necessarily limited to, RIE and opticallithography.

FIG. 4 is a cross-sectional view of bottom source/drain formation in amethod of manufacturing a semiconductor device, according to anexemplary embodiment of the present invention. Referring to FIG. 4,bottom source/drain regions 130 are formed in the gate regions G1 and G2around the fins 110. The bottom source/drain regions 130 can be formedby a bottom-up epitaxial growth process (with optional dummy verticaldielectric liners covering fin sidewalls during epitaxial growth),wherein the bottom source/drain regions 130 are grown to certain height(thickness) such as, but not necessarily limited to about 10 nm to about50 nm. The epitaxially grown bottom source/drain regions 130 can bedoped using processes, such as, for example, ion implantation, in situ,gas phase doping, plasma doping, plasma immersion ion implantation,cluster doping, infusion doping, liquid phase doping, solid phasedoping, etc., and dopants may include, for example, an n-type dopantselected from a group of phosphorus (P), arsenic (As) and antimony (Sb),and a p-type dopant selected from a group of boron (B), gallium (Ga),indium (In), and thallium (Tl) at various concentrations. For example,in a non-limiting example, a dopant concentration range may be 1e18/cm³to 1e21/cm³.

Terms such as “epitaxial growth” and “epitaxially formed and/or grown”refer to the growth of a semiconductor material on a deposition surfaceof a semiconductor material, in which the semiconductor material beinggrown has the same crystalline characteristics as the semiconductormaterial of the deposition surface. In an epitaxial deposition process,the chemical reactants provided by the source gases are controlled andthe system parameters are set so that the depositing atoms arrive at thedeposition surface of the semiconductor substrate with sufficient energyto move around on the surface and orient themselves to the crystalarrangement of the atoms of the deposition surface. Therefore, anepitaxial semiconductor material has the same crystallinecharacteristics as the deposition surface on which it is formed. Forexample, an epitaxial semiconductor material deposited on a {100}crystal surface will take on a {100} orientation.

Examples of various epitaxial growth processes include, for example,rapid thermal chemical vapor deposition (RTCVD), low-energy plasmadeposition (LEPD), ultra-high vacuum chemical vapor deposition (UHVCVD),atmospheric pressure chemical vapor deposition (APCVD), liquid-phaseepitaxy (LPE), molecular beam epitaxy (MBE) and metal-organic chemicalvapor deposition (MOCVD). The temperature for an epitaxial growthprocess can range from, for example, 550° C. to 900° C., but is notnecessarily limited thereto, and may be conducted at higher or lowertemperatures as needed.

A number of different sources may be used for the epitaxial growth. Forexample, the sources may include precursor gas or gas mixture includingfor example, a silicon containing precursor gas (such as silane) and/ora germanium containing precursor gas (such as a germane). Carrier gaseslike hydrogen, nitrogen, helium and argon can be used.

FIG. 5 is a cross-sectional view of dummy spacer formation in a methodof manufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 5, dummy spacerlayers 140 are formed on exposed horizontal surfaces including isolationregions 121, the bottom source/drain regions 130 and on the hardmasks110, which are on the fins 105. The material of the dummy spacer layer140 includes, but is not necessarily limited to, PSG, BSG or BPSG,deposited using, for example, directional deposition techniques,including, but not necessarily limited to high density plasma (HDP)deposition and gas cluster ion beam (GCIB) deposition. The directionaldeposition deposits the spacer material preferably on the exposedhorizontal surfaces, but not on lateral sidewalls. In addition, anisotropic etch can be performed to remove any dummy spacer material thatmay have been formed on vertical surfaces, such as lateral sidewalls. Inaccordance with an embodiment of the present invention, a thickness ofthe dummy spacer layer 140 (i.e., vertical height) is about 2 nm to 15nm. In accordance with an embodiment of the present invention, the dummyspacer layer 140 is doped with, for example, boron and/or phosphorousduring deposition. The dopant concentrations of the PSG, BSG or BPSG canbe for example in the general range of e17 to e22/cm³ for both boron andphosphorus dopants.

FIG. 6 is a cross-sectional view of dummy spacer removal from a thinoxide device region in a method of manufacturing a semiconductor device,according to an exemplary embodiment of the present invention. Referringto FIG. 6, the dummy spacer layers 140 are removed from what is tobecome a region having a device(s) with a relatively thin gate oxide(“thin oxide region”). The dummy spacer layers 140 remain in what is tobecome a region having a device(s) with a relatively thick gate oxide(“thick oxide region”). As noted herein, a thick oxide region mayinclude a gate oxide that is about 2 nm to 10 nm thicker than a gateoxide in a thin oxide region, which is about 2 nm thick. As shown inFIG. 6, an organic planarization layer (OPL) 150 is formed in the thickoxide region to cover (e.g., mask) the dummy spacer layers 140 in thethick oxide region so that the dummy spacer layers 140 in the thin oxideregion can be removed while the covered dummy spacer layers 140 in thethick oxide region remain. The dummy spacer layers 140 in the thin oxideregion can be removed using, for example, a reactive ion etch (RIE)process containing tetrafluoromethane (CF₄) or a wet etch processcontaining hydrofluoric acid (HF).

In accordance with an embodiment of the present invention, the OPLmaterial may be an organic polymer including C, H, and N. In anembodiment, the OPL material can be free of silicon (Si). According toan embodiment, the OPL material can be free of Si and fluorine (F). Asdefined herein, a material is free of an atomic element when the levelof the atomic element in the material is at or below a trace leveldetectable with analytic methods available in the art. Non-limitingexamples of the OPL material include JSR HM8006, JSR HM8014, AZ UM10M2,Shin Etsu ODL 102, or other similar commercially available materialsfrom such vendors as JSR, TOK, Sumitomo, Rohm & Haas, etc. The OPLmaterial can be deposited, for example, by spin coating. The OPLmaterial can be patterned into the OPL 150 covering the thick oxideregion by using an anisotropic removal process, such as, for example, areactive ion etch (RIE) process, or by lithography and/or doublepatterning processes.

FIG. 7 is a cross-sectional view of removal of an organic planarizationlayer (OPL) and bottom junction drive-in annealing in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 7, the OPL 150 isstripped using, for example, oxygen plasma, nitrogen plasma, hydrogenplasma or other carbon strip process. OPL stripping causes minimal or nodamage to the fins 105 or the layers 121, 140 and 110. Followingstripping of the OPL 150, bottom junction drive-in annealing isperformed in both thick and thin oxide regions to form bottomsource-drain junctions 161 and 163 in thick and thin oxide regions,respectively. As can be seen in FIG. 7 by comparing lines A and B, dueto the dummy spacer layer 140 comprising BSG, PSG or BPSG, thesource-drain junctions 161 in the thick oxide region penetrate into thefins 105 at a greater height than the source-drain junctions 163 in thethin oxide region. As shown in FIG. 7, the resulting height of the upperedges of the source-drain junctions 161 on the fins 105 in the thickoxide region is greater than the resulting height of the upper edges ofthe source-drain junctions 163 in the thin oxide region.

The source-drain junctions 161 are formed by dopant diffusion into thefins 105 from the dummy spacer layer 140 and a bottom source/drainregion 130, while the source-drain junctions 163 are formed by dopantdiffusion into the fins 105 from the bottom source/drain region 130 andnot from a dummy spacer layer 140. A doping concentration can be higherat areas of the fins 105 closer to the source/drain regions 130 than atareas of the fins farther away from the source/drain regions 130. Thedrive-in annealing process can be performed at temperatures in the rangeof, for example, about 800° C. to 1300° C. and in durations in the rangeof, for example, about 0.01 seconds to 10 minutes.

FIG. 8 is a cross-sectional view of dummy spacer removal from a thickoxide device region and bottom spacer formation in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 8, the dummyspacer layers 140 are selectively removed from the thick oxide regionusing, for example, an etching process, such as, a reactive ion etch(RIE) process containing tetrafluoromethane (CF₄) or a wet etch processcontaining hydrofluoric acid (HF).

Spacer material 170 is formed on exposed horizontal surfaces includingisolation regions 121, the bottom source/drain regions 130 and on thehardmasks 110, which are on the fins 105. Spacer material 170 includes,but is not necessarily limited to, plasma enhanced chemical vapordeposition (PECVD)-type, high aspect ratio process (HARP)-type or highdensity plasma (HDP)-type low-K dielectric layers, including, but notlimited to, silicon boron nitride (SiBN), siliconborocarbonitride(SiBCN), silicon oxycarbonitride (SiOCN), SiN or SiO₂. The spacermaterial 170 is deposited using, for example, directional depositiontechniques, including, but not necessarily limited to high densityplasma (HDP) deposition and gas cluster ion beam (GCM) deposition. Thedirectional deposition deposits the spacer material preferably on theexposed horizontal surfaces, but not on lateral sidewalls. The spacermaterial 170 formed on isolation regions 121 and on the hardmasks 110will later be removed during the CMP of gate stack materials, leavingthe spacer material 170 on the bottom source/drain regions 130. Thespacer material 170 on the bottom source/drain regions 130 is hereinreferred to as bottom spacer layers or bottom spacers 170.

FIG. 9 is a cross-sectional view of gate structure formation in a methodof manufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 9, the gatestructures include gate layers 175, 176 and gate oxide layers 181, 182are formed in the thick and thin oxide regions. As can be seen, as shownby a comparison of t1 and t2, the gate oxide layers 181 are thicker(e.g., about 2 nm to 10 nm thicker) than the gate oxide layers 182. Inaccordance with an embodiment of the present invention, the gate oxidelayers 181, 182 include an interfacial dielectric layer including, butnot necessarily limited to, SiO₂ (silicon dioxide), a high-K dielectriclayer including but not necessarily limited to, HfO₂ (hafnium oxide),ZrO₂ (zirconium dioxide), hafnium zirconium oxide Al₂O₃ (aluminumoxide), and Ta₂O₅ (tantalum pentoxide). The gate layers 175, 176include, for example, a work-function metal (WFM) layer, including butnot necessarily limited to, for a pFET, titanium nitride (TiN), tantalumnitride (TaN) or ruthenium (Ru), and for an nFET, TiN, titanium aluminumnitride (TiAlN), titanium aluminum carbon nitride (TiAlCN), titaniumaluminum carbide (TiAlC), tantalum aluminum carbide (TaAlC), tantalumaluminum carbon nitride (TaAlCN) or lanthanum (La) doped TiN, TaN. Thegate layers 175, 176 further include a gate conductor including, but notlimited to amorphous silicon (a-Si), or metals, such as, for example,tungsten, cobalt, zirconium, tantalum, titanium, aluminum, ruthenium,copper, metal carbides, metal nitrides, transition metal aluminides,tantalum carbide, titanium carbide, tantalum magnesium carbide, orcombinations thereof.

The gate structures are deposited on the spacers 170 on and around thefins 110, and on the isolation regions 121, using, for example,deposition techniques including, but not limited to, CVD, PECVD, RFCVD,PVD, ALD, MLD, MBD, PLD, LSMCD, sputtering, and/or plating. Aplanarization process, such as, for example, CMP, is performed to removeexcess portions of the gate structures and spacer material 170 on thehardmasks 110, and on the isolation regions 121 to result in thestructure shown in FIG. 9.

In accordance with an embodiment of the present invention, in order toform the different gate structures including the gate oxide layers 181,182 having different thicknesses from each other, block masks are usedduring gate oxide deposition. For example, the thick oxide region can bemasked during deposition of the gate oxide 182, and the thin oxideregion can be masked during deposition of the gate oxide 181.

FIG. 10 is a cross-sectional view of recessing of gate structures in amethod of manufacturing a semiconductor device, according to anexemplary embodiment of the present invention. Referring to FIG. 10,portions of the gate structures including the gate layers 175, 176 andthe gate oxide layers 181, 182, are removed using, for example, ananisotropic etch process, such as ME, ion beam etching, plasma etchingor laser ablation. As can be seen, the gate structures are recessed to alower height above the substrate 101. According to an embodiment,recessing is performed by a wet or dry etching process that is selectivewith respect to materials of the fins 105, the isolation layers 121 andthe hardmasks 110. Etch chemistry for recessing the gate structures caninclude, for example, sulfur hexafluoride (SF₆) and nitrogen (N₂).

FIG. 11 is a cross-sectional view of formation of top spacers, topsource/drain regions and top source-drain junctions in a method ofmanufacturing a semiconductor device, according to an exemplaryembodiment of the present invention. Referring to FIG. 11, spacermaterial is formed on exposed horizontal surfaces including isolationregions 121, the gate FIG. 11 is a cross-sectional view of formation oftop spacers, top source/drain regions and top source-drain junctions ina method of manufacturing a semiconductor device, according to anexemplary embodiment of the present invention. Referring to FIG. 11,spacer material is formed on exposed horizontal surfaces includingisolation regions 121, the gate structures and on the hardmasks 110,which are on the fins 105. Spacer material includes, but is notnecessarily limited to, PECVD-type, HARP-type or HDP-type low-Kdielectric layers, including, but not limited to, SiBN, SiBCN, SiOCN,SiN or SiO₂. The spacer material is deposited using, for example,directional deposition techniques, including, but not necessarilylimited to HDP deposition and GCIB deposition. The directionaldeposition deposits the spacer material preferably on the exposedhorizontal surfaces, but not on lateral sidewalls. The spacer materialformed on isolation regions 121 and on the hardmasks 110 will later beremoved by CMP, leaving the spacer material 172 on the gate structures.The spacer material 172 on the gate structures is herein referred to astop spacer layers or top spacers 172.

The hardmasks 110 are selectively removed, using for example, aselective etch process. The selective etch process can include, forexample, a wet etch process containing phosphoric acid at a temperaturearound 80° C. Upper portions of the fins 105 may be optionally removedusing, for example, an anisotropic etch process, such as RIE, ion beametching, plasma etching or laser ablation. The fins 105 can be recessedto a height above the substrate 101 near an upper surface of the topspacer layer 172. The recessing can result in a height of the fins 120which is at, or slightly above or below the upper surface of the topspacer layer 172. According to an embodiment, recessing is performed bya wet or dry etching process that is selective with respect to thematerials of the isolation regions 121 and the spacer layers 172. Etchchemistry for recessing the fins 105 can include, for example, chlorinegas. According to an embodiment of the present invention, the recessingof the fins 105 is not performed, and the method proceeds from thehardmask removal to epitaxial growth of a top source/drain region 132without recessing the fins 105.

Top source/drain regions 132 are epitaxially grown on the fins 105 andon the spacer layers 172 between isolation regions 121. In accordancewith an embodiment of the present invention, for an nFET, an As or Pdoped Si or SiC source/drain region 132 is epitaxially grown. For apFET, a B doped SiGe or Si source/drain region 132 is epitaxially grown.Doping can be at concentrations in the general range of e19 to e21/cm³.

Top junction drive-in annealing or dopant implantation is performed inboth thick and thin oxide regions to form top source-drain junctions 165and 167 in thick and thin oxide regions, respectively.

Referring to line C in FIG. 11, an upper edge of the source-drainjunction 161 in the thick oxide region remains at a greater height onthe fins than an upper edge of the source-drain junction 163 in the thinoxide region.

The top source-drain junctions 165 and 167 are formed by dopantdiffusion or implantation into the top portion of the fins 105 from thetop source/drain regions 132. A doping concentration can be higher atareas of the fins 105 closer to the source/drain regions 132 than atareas of the fins farther away from the source/drain regions 132.

As can be understood further downstream processing can be performed toform inter-level dielectric (ILD) layers and electrically conductivecontact regions to gate structures and source/drain regions.

Although illustrative embodiments of the present invention have beendescribed herein with reference to the accompanying drawings, it is tobe understood that the invention is not limited to those preciseembodiments, and that various other changes and modifications may bemade by one skilled in the art without departing from the scope orspirit of the invention.

We claim:
 1. A method for manufacturing a semiconductor device,comprising: forming a first plurality of fins in a first device regionon a substrate; forming a second plurality of fins in a second deviceregion on the substrate; forming bottom source/drain regions on thesubstrate and around lower portions of each of the first and secondplurality of fins in the first and second device regions; forming adummy spacer layer on the bottom source/drain region in the first deviceregion, wherein the dummy spacer layer includes one or more dopants; andforming a plurality of doped regions in the first and second pluralityof fins in the first and second device regions; wherein the plurality ofdoped regions in the first device region extend to a greater height onthe first plurality of fins than the plurality of doped regions in thesecond device region on the second plurality of fins.
 2. The methodaccording to claim 1, wherein the dummy spacer layer comprises at leastone of phospho-silicate glass (PSG), boro-silicate glass (BSG) andboro-phospho-silicate glass (BPSG).
 3. The method according to claim 1,further comprising: forming a first gate structure comprising a gateoxide layer in the first device region; and forming a second gatestructure comprising a gate oxide layer in the second device region;wherein the gate oxide layer of the first gate structure is thicker thanthe gate oxide layer of the second gate structure.
 4. The methodaccording to claim 1, wherein the plurality of doped regions are formedby a drive-in annealing process.
 5. The method according to claim 1,further comprising forming a dummy spacer layer on the bottomsource/drain region in the second device region.
 6. The method accordingto claim 5, further comprising forming a mask layer in the first deviceregion to cover the dummy spacer layer in the first device region, whileleaving exposed the dummy spacer layer in the second device region. 7.The method according to claim 6, further comprising removing the exposeddummy spacer layer from the second device region.
 8. The methodaccording to claim 1, further comprising removing the dummy spacerlayer.
 9. The method according to claim 8, further comprising formingbottom spacer layers on the bottom source/drain regions in the first andsecond device regions.
 10. The method according to claim 9, furthercomprising: forming a first gate oxide layer on the bottom spacer layerin the first device region; and forming a second gate oxide layer on thebottom spacer in the second device region; wherein the first gate oxidelayer is thicker than the second gate oxide layer.
 11. The methodaccording to claim 10, further comprising: forming a gate layer on thefirst gate oxide layer in the first device region; and forming a gatelayer on the second gate oxide layer in the second device region. 12.The method according to claim 11, further comprising recessing the gatelayers and the first and second gate oxide layers in the first andsecond device regions.
 13. The method according to claim 12, forming topspacer layers on the recessed gate layers and the first and second gateoxide layers in the first and second device regions.
 14. The methodaccording to claim 13, further comprising forming top source/drainregions on the top spacer layers and extending from the first and secondplurality of fins in the first and second device regions.
 15. The methodof according to claim 14, further comprising forming a plurality ofadditional doped regions at upper portions of the first and secondplurality of fins in the first and second device regions.
 16. Asemiconductor device, comprising: a plurality of vertical transistors ona substrate, wherein each of the plurality of vertical transistorscomprises: a channel region extending vertically from the substrate,wherein the channel region includes a junction portion extendingvertically from a bottom of the channel region; a bottom source/drainregion on the substrate and around a lower portion of the channelregion; a gate structure on the bottom source/drain region, wherein thegate structure comprises a gate oxide layer; and a top source/drainregion on the gate structure and extending from the channel region;wherein a junction portion corresponding to a first vertical transistorof the plurality of vertical transistors extends to a greater heightabove a corresponding bottom source/drain region of the first verticaltransistor than a junction portion corresponding to a second verticaltransistor of the plurality of vertical transistors.
 17. Thesemiconductor device according to claim 16, wherein a gate oxide layerof the first vertical transistor is thicker than a gate oxide layer ofthe second vertical transistor.
 18. A method for manufacturing asemiconductor device, comprising: forming a first plurality of channelregions in a first device region on a substrate; forming a secondplurality of channel regions in a second device region on the substrate;forming bottom source/drain regions on the substrate and around lowerportions of each of the first and second plurality of channel regions inthe first and second device regions; forming a dummy spacer layer on thebottom source/drain region in the first device region, wherein the dummyspacer layer includes one or more dopants; and forming a plurality ofjunction portions in the first and second plurality of channel regionsin the first and second device regions; wherein the plurality ofjunction portions in the first device region extend to a greater heightabove the bottom source/drain regions than the plurality of junctionportions in the second device region.
 19. The method according to claim18, wherein the dummy spacer layer comprises at least one ofphospho-silicate glass (PSG), boro-silicate glass (BSG) andboro-phospho-silicate glass (BPSG).
 20. The method according to claim18, further comprising: forming a first gate structure comprising a gateoxide layer in the first device region; and forming a second gatestructure comprising a gate oxide layer in the second device region;wherein the gate oxide layer of the first gate structure is thicker thanthe gate oxide layer of the second gate structure.